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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 5, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 3 minutes
Spring has definitely sprung; it was 81 degrees last week in Atlanta, and this week it’s been in the 40s. That’s typical spring weather in Atlanta. My newly cut lawn is looking great, thanks to my “yard guy” Clive.
And now our industry’s trade show season is in full swing. I’m all checked in and heading to Anaheim to cover IPC APEX EXPO next week. There’s a lot going on there this year, especially in PCB design. The number of design-related conference classes continues to grow with each show. That’s a good thing: New designers are entering the workforce, slowly but surely, and many companies are losing their subject matter experts to retirement.
IPC APEX EXPO will be held in Anaheim for the next couple of years. The last time I attended in Anaheim was about 20 years ago, and I never did make it to Disneyland. I’m shooting for some Mouse time this year.
I need to finish packing, so without further ado, here’s my must-reads for this week. I hope to see you in California.
Tim’s Takeaways: The Art of Technical Instruction
Published April 4
Speaking of PCB design, do you have what it takes to be a design instructor? You might. As columnist Tim Haas explains, there’s a need for design instructors, and if you’re constantly doing research and reading the latest white papers, you might be a great candidate for a design instructor. He also provides a few horror stories from his design teaching days. Check it out.
Creators of SMT UHDI Test Board Vehicle Discuss this Important Project
Published April 4
Chrys Shea led the development of the SMT test vehicle a few years ago. As features continued to shrink, the industry saw a need for a UHDI test vehicle, so Chrys and Altium’s David Haboud sprang into action. In this audio interview, they discuss what it took to update the test vehicle to UHDI and why technologists working in UHDI should check it out for themselves.
Global Sourcing Spotlight: Don’t Be Afraid of Global Sourcing
Published April 3
No matter how good things are going, some of us have this nagging suspicion in the back of our minds that there’s another snafu waiting around the corner, and another supply chain shutdown probably ranks Numero Uno in that category. But as columnist Bob Duke explains, despite two shooting wars and our stressful relationship with China, global sourcing is not only looking solid—it actually might help bring nations closer together and stave off potential conflicts. As he says, “Business is all about people.”
Checking In With ICAPE Group
Published April 3
ICAPE operates in countries around the globe, from China to South Africa to the U.S., so the company has a pretty broad view of the fab industry. In this interview, ICAPE’s Erik Pedersen explains how they approach sustainability, what sustainability actually entails, and why value engineering is so critical.
IPC APEX EXPO 2024: There’s an App for That
Published April 3
If you’re heading to IPC APEX EXPO, you’ve probably noticed that there are so many classes and “special events” taking place, often at the same time. Make it easy on yourself and scan this handy-dandy APEX QR code, and you’ll be able to see each day’s events at a glance while getting alerts for the events that are most important to you.
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Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
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Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
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Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
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