-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Cadence Acquires Invecas to Accelerate System Realization
January 9, 2024 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that it has acquired Invecas, Inc., a leading provider of design engineering, embedded software and system-level solutions, headquartered in Santa Clara, California. The purchase adds a skilled system design engineering team to Cadence, with expertise in providing customers with custom solutions across chip design, product engineering, advanced packaging and embedded software.
Accelerating trends such as digital transformation of multiple vertical markets and more system companies building custom silicon continue to drive strong design activity. Additionally, with classic Moore’s law slowing down, new “More than Moore” technologies, such as advanced 2.5D/3D packaging and chiplets, are paving the way for significant performance and manufacturing efficiencies. These strategic generational trends, underpinned by advancements in AI, are ushering in a new era of design and spurring a rapidly growing customer need for skilled end-to-end engineering expertise in enabling their custom silicon and system development efforts.
The acquisition brings a skilled engineering team centered in Hyderabad, led by Invecas CEO Dasaradha Gude, that has vast experience in delivering end-to-end system solutions with deep expertise in advanced nodes, mixed-signal, verification, embedded software, packaging and turnkey custom silicon production. Invecas has built close relationships with key players in the design ecosystem as well as with top foundry and assembly and test partners. With extensive experience designing chips and taking them to production, Invecas has served hundreds of customers across various verticals, including mobile, networking, hyperscaler and automotive. In addition to Cadence’s leading EDA solutions, Invecas will also leverage and augment Cadence’s broad IP portfolio to enable more comprehensive custom product solutions.
“With complexity and challenges increasing due to the proliferation of AI, 2.5D/3D and chiplet designs, customers need access to experienced teams that can assist with bringing designs from ideation to production,” said Boyd Phelps, senior vice president and general manager, Silicon Solutions Group, Cadence. “With the acquisition of Invecas, Cadence is able to scale our system design engineering offerings to support customers in critical high-growth verticals who are faced with the need to aggressively increase performance while tackling ever-increasing system-level complexity.”
“Generational trends are accelerating the increases in design complexity and driving a customer need for skilled engineering talent that can assist with system design,” said Dasaradha Gude, CEO, Invecas. “We are excited to join the Cadence team and to enhance the solutions available to customers, utilizing our core expertise to accelerate customer silicon and system development efforts.”
The terms of the transaction were not disclosed. The acquisition is expected to be immaterial to Cadence’s total revenue and earnings this year.
Suggested Items
Redwire Announces Development of New European-Built Very Low Earth Orbit (VLEO) Spacecraft Platform called Phantom
05/13/2024 | BUSINESS WIRERedwire Corporation, a leader in space infrastructure for the next generation space economy, announced Phantom, a new European Very Low Earth Orbit (VLEO) spacecraft platform.
Emerald Technologies Acquires Optimum
05/13/2024 | Emerald TechnologiesEmerald Technologies announced its acquisition of Optimum Design Associates, Inc. (Optimum), a leading electronic design and engineering services company. Terms were not disclosed.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
05/13/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.
SEMI Recognizes U.S. Senator Majority Leader Charles Schumer With Government Leadership Award for Outstanding Support of U.S. Chip Industry
05/13/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, announced that the SEMI North America Advisory Board has presented the annual SEMI Americas Government Leadership Award to U.S. Senate Majority Leader Charles (Chuck) Schumer in recognition of his extraordinary support of the U.S. semiconductor industry.
Real Time with… IPC APEX EXPO 2024: Magnalytix's Services and Trends in the Electronics Industry
05/10/2024 | Real Time with...IPC APEX EXPOMike Bixenman, president of Magnalytix, explains Magnalytix's services, including third-party validation, test boards, electrical testing, and comprehensive reports. He also discusses emerging trends such as power electronics and reliability. Standards and design improvements also form part of this conversation.